The **ATS-04H-121-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient thermal management for electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-04H-121-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.56 °C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine-Pitch | --- ### Key Design Components #### 1. Material and Coating * **Aluminum Body:** Provides an optimal balance between weight and thermal conductivity. * **Blue Anodized Finish:** Not only improves the aesthetic but also provides a layer of protection against corrosion and enhances surface emissivity. #### 2. Fin Configuration * **Fine-Pitch Design:** This model utilizes a high density of fins to increase the overall surface area. A larger surface area allows for more heat to dissipate into the surrounding air via convection. #### 3. Attachment Mechanism (pushPIN™) * The assembly uses a **push-pin and spring system**. This ensures even pressure across the electronic component (die), which is critical for maximizing the effectiveness of the thermal interface material (TIM). * **Pre-assembled Springs:** The springs provide a calculated compression force to prevent damage to the PCB while maintaining firm contact. #### 4. Thermal Interface Material (TIM) * The "C3" in the part number indicates that this unit typically comes with **T412** thermal tape or a similar high-performance phase-change material pre-applied to the base, ensuring immediate installation readiness. --- ### Performance Data Thermal performance is measured by the resistance to heat flow. Lower values indicate better cooling. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 9.56 | 5.11 | 3.97 | 3.41 | 3.06 | | **Ducted Flow (°C/W)** | 4.33 | 3.21 | 2.72 | 2.42 | 2.21 | --- ### Typical Applications * **Embedded Systems:** For cooling SoCs (System on a Chip). * **Telecommunications:** Cooling of high-speed networking processors. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.