The **ATS-04H-122-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for the thermal management of electronic components such as CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 5.87°C/W (at 100 LFM) | | **Airflow Pattern** | Square / Cross-Cut (Omni-directional) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System This heat sink utilizes a specialized **pushPIN™** mechanism. This is a spring-loaded attachment system that ensures a consistent and precise pressure is applied to the electronic component. This pressure is vital for maximizing the efficiency of the heat transfer from the chip to the heat sink. #### B. Cross-Cut Fin Design The fins are not simple straight rows; they are "cross-cut." This allows for: * **Omni-directional Airflow:** The heat sink can accept air from any direction, making it ideal for cramped PCB layouts where airflow direction is unpredictable. * **Increased Surface Area:** The design maximizes the contact area with the air, facilitating faster heat dissipation. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the component surface and the heat sink base. * **Benefit:** Reduces thermal resistance, ensuring the heat sink operates at its maximum theoretical efficiency immediately upon installation. --- ### 3. Application Use Cases This specific model is commonly used in industrial and high-speed computing environments: 1. **Telecommunications:** Cooling chips in routers and switches. 2. **Embedded Systems:** Protecting processors in industrial automation hardware. 3. **Power Supplies:** Managing heat for high-output power transistors. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04:** Series/Type. * **H:** High-performance fin geometry. * **122:** Dimensional/Specific model code. * **C2:** Blue Anodized finish. * **R0:** Revision/Standard packaging code.