ATS-04H-125-C2-R0
AI

The **ATS-04H-125-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components like CPUs, GPUs, and other high-power surface-mount devices.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 50mm x 50mm x 30mm |
| **Attachment Type** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
| **Fin Style** | Straight (Square) |
| **Mounting Hole Pattern** | 43mm x 43mm |
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### 2. Electronic Application & Performance
This part is specifically engineered to manage heat dissipation in constrained spaces. Its effectiveness is measured by **Thermal Resistance**, which determines how many degrees Celsius the temperature rises per Watt of power dissipated.
#### Thermal Performance Chart
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 3.91 |
| **300 (1.5 m/s)** | 2.13 |
| **500 (2.5 m/s)** | 1.73 |
| **700 (3.5 m/s)** | 1.51 |
### 3. Key Electronic Features
* **Push-Pin Attachment:** Features a flexible, brass-weighted push-pin mechanism. This provides a secure, consistent mounting pressure onto the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM).
* **T766 Thermal Interface:** The "C2" in the part number indicates it comes pre-applied with T766 phase-change material. This fills microscopic air gaps between the component and the heat sink to maximize heat transfer.
* **Omnidirectional Airflow:** While featuring straight fins, the layout is optimized for high-density boards where airflow may come from multiple directions.
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### 4. Part Number Breakdown
Understanding the coding for this specific series:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04H:** Series/Family type.
* **125:** Specific size/fin configuration code.
* **C2:** Thermal Interface Material (T766).
* **R0:** RoHS Compliance (Lead-free).
- ⤷What are the mechanical clearance requirements for the 43mm x 43mm hole pattern?
- ⤷ How does T766 phase-change material compare to standard thermal grease?
- ⤷ What are the alternative attachment methods if my PCB doesn't have holes?