The **ATS-04H-126-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 5.47 °C/W (Unducted Flow @ 100 LFM) | | **Pitch (Hole spacing)** | 47.00mm | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body * **Material:** Made from high-grade aluminum for a balance between weight, cost, and thermal conductivity. * **Fin Geometry:** Features a "Straight Fin" design. This is optimized for airflow directed through the fins, allowing heat to dissipate from the base to the surrounding air. * **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### B. pushPIN™ Attachment System This part uses a specific mechanical mounting system instead of adhesive tape: * **Push Pins:** Durable brass or plastic pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure consistent pressure (7-10 PSI) between the heat sink and the electronic component, which is critical for minimizing thermal interface resistance. #### C. Thermal Interface Material (TIM) * The "-R0" designation typically implies the part comes with a pre-applied high-performance thermal interface material (usually **T766**), which fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases The ATS-04H-126-C2-R0 is commonly used in environments where space is limited but thermal loads are high: 1. **Telecommunications:** Cooling ASICs and FPGAs in networking switches. 2. **Industrial PCs:** Maintaining stable temperatures for embedded processors. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. ---