The **ATS-04H-127-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). Below is the detailed breakdown of its specifications and electronic application characteristics. ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Top Mount) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 3.84°C/W (at 100 LFM / 0.5 m/s) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Pitch / Fin Pattern** | Square / Grid-like coverage | --- ### 2. Functional Components This part is not a passive metal block; it is an engineered assembly consisting of three main electronic packaging elements: * **The Heat Sink Body:** Extruded aluminum designed with a specific fin density to maximize surface area for heat dissipation into the surrounding air. * **The Attachment (pushPIN™):** A specialized mechanism using a brass or plastic pin and a stainless steel spring. This ensures a precise "Calculated Compression" force, providing consistent pressure against the electronic component (CPU/GPU/FPGA). * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal pad or grease (T766) to fill microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application in Electronics The ATS-04H-127-C2-R0 is used to prevent **thermal throttling** or permanent damage in high-speed electronic circuits. #### Common Target Components: * **FPGAs & ASICs:** Used in telecommunications and data processing. * **Processors:** Low-to-medium power CPUs in industrial PCs. * **Power Modules:** High-output voltage regulators that generate significant waste heat. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 3.84 | | 300 | 1.5 | 2.05 | | 500 | 2.5 | 1.62 | | 700 | 3.5 | 1.40 | ---