The **ATS-04H-13-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic systems. --- ## 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 50mm x 50mm x 15mm | | **Fin Type** | Push-Pin (High Density) | | **Mounting Style** | Push-Pin (2-hole) | | **Thermal Resistance** | 13.70 °C/W @ Natural Convection | | **Attachment Method** | Spring-loaded push pins | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Cross-Cut) The unit features a **cross-cut** fin design. Unlike straight-fin heat sinks, the cross-cut pattern allows for multi-directional airflow. This makes it ideal for dense PCB layouts where the direction of cooling air may not be perfectly linear. ### B. Push-Pin Attachment Mechanism This model utilizes a mechanical attachment system consisting of: * **Plastic/Brass Push-Pins:** To secure the sink to the PCB. * **Compression Springs:** To ensure consistent downward pressure on the electronic component (CPU/GPU/FPGA), which optimizes heat transfer. ### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes pre-applied with a high-performance **Phase Change Material (PCM)** or thermal tape. This eliminates the need for manual application of thermal paste. --- ## 3. Decoding the Part Number Electronic parts often follow a nomenclature system. Here is the breakdown for this specific part: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **04** | Series Identifier | | **H** | Fin Pitch (High density) | | **13** | Height (15mm profile) | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Packaging/TIM Revision | --- ## 4. Typical Applications * **Network Switches/Routers:** Cooling ASICs and high-speed processors. * **Industrial PCs:** Thermal management for embedded systems. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.