The **ATS-04H-131-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 52.83mm x 61.00mm x 17.78mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.60°C/W (at 200 LFM) | | **Airflow Path** | Horizontal (Designed for cross-flow) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic & Mechanical Design Features #### A. The maxiFLOW™ Geometry The "Electronic" effectiveness of this part comes from its specific fin geometry. The fins are tapered and spread out to increase surface area while minimizing pressure drop. This allows for better heat dissipation even in systems with low airflow speeds. #### B. pushPIN™ Attachment System Instead of simple adhesive, this model uses a mechanical **pushPIN™** system. * **Reliability:** It ensures a constant, high-pressure contact between the heat sink and the chip. * **Shock/Vibration:** The spring-loaded mechanism protects the delicate electronic component (the silicon die) from mechanical stress during shipping or operation. #### C. T766 Phase Change Material The "R0" suffix indicates that it comes pre-applied with **T766** thermal interface material. * **Function:** It fills the microscopic air gaps between the heat sink base and the electronic chip. * **Performance:** It provides high thermal conductivity, ensuring that the heat generated by the electronics is efficiently transferred to the aluminum fins. ### 3. Application Use-Cases This heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs where space is limited. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators. ---