The **ATS-04H-133-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. General Specifications This part is specifically engineered for high-density thermal management in compact electronic environments. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04H-133-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The dimensions determine the physical footprint on the Printed Circuit Board (PCB). | Dimension | Measurement | | :--- | :--- | | **Size (L x W)** | 70.00 mm x 70.00 mm | | **Height** | 10.00 mm | | **Pitch (Hole-to-Hole)** | 63.00 mm | | **Spring/Pin Material** | Brass / Stainless Steel | --- ### 3. Thermal Performance Thermal resistance indicates how effectively the heat sink transfers heat away from the electronic component into the surrounding air. * **Thermal Resistance (Unducted Flow):** 7.42 °C/W @ 100 LFM * **Thermal Resistance (Ducted Flow):** 1.44 °C/W @ 200 LFM * **Design Application:** The "C2" suffix indicates it is made from aluminum with a specific performance profile, while "R0" typically denotes the revision or packaging style. --- ### 4. Component Features The ATS-04H-133-C2-R0 includes several key engineering features: * **Push-Pin Attachment:** Uses a flexible attachment system that provides a secure, tool-free connection to the PCB. * **Compression Springs:** Ensures consistent pressure (clamping force) on the electronic component to maximize thermal transfer through the TIM. * **Fine Pitch Fins:** Designed for "straight fin" airflow, which is ideal for systems with a specific direction of forced air (fans). * **T766 TIM:** A high-performance thermal interface material is pre-applied to the bottom, reducing assembly time and ensuring a low-resistance path between the chip and the aluminum. --- ### 5. Application Use Cases This component is typically found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial PCs:** Compact enclosures where height is limited to 10mm. 3. **Power Supplies:** Dissipating heat from MOSFETs or Power ICs.