The **ATS-04H-138-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Fine Pitch (Straight Fins) | | **Thermal Resistance (Unducted)** | 12.31 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.48 °C/W @ 100 LFM | --- ### 2. Key Electronic Features While the heat sink itself is a mechanical component, its design is critical for the reliability of electronic circuits: * **Thermal Interface Material (TIM):** This part comes pre-applied with **T766**, a high-performance thermal grease that ensures maximum heat transfer between the electronic chip and the aluminum base. * **pushPIN™ Attachment:** Unlike adhesive tapes, the pushPIN™ system uses a flexible, spring-loaded mechanism. This provides constant pressure on the electronic component, which prevents "lifting" or air gaps that could lead to thermal runaway. * **Space Optimization:** At 25mm x 25mm, it is designed for small-form-factor electronics (SFF) where board real estate is limited. * **EMI/EMC Compatibility:** Being made of aluminum, it does not interfere with electromagnetic signals, though its grounding depends on the mounting method to the PCB. --- ### 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling small chipsets in routers or switches. 2. **Embedded Systems:** Industrial PCs where fanless cooling is preferred. 3. **Power Electronics:** Managing heat for voltage regulators or high-speed controllers. ---