The **ATS-04H-141-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient thermal management for electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 10.00mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 15.90 °C/W (at 100 LFM) | --- ### 2. Key Features & Components * **Heat Sink Material:** Made of aluminum for optimal weight-to-thermal conductivity ratio. The blue anodized finish prevents corrosion and improves thermal emissivity. * **Fin Design:** It features a **Straight Fin** or **Fine Pitch** pattern. This maximizes surface area for heat dissipation into the surrounding air. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this uses a spring-loaded pin mechanism. * **Springs:** Provide precise pressure to ensure consistent contact between the sink and the component. * **Pins:** Available in plastic or brass to lock into the PCB holes. * **Pre-applied TIM:** Usually comes with a high-performance **Thermal Interface Material (TIM)** pre-applied to the base, ensuring there are no air gaps between the heat source and the sink. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 0.5 | 15.90 °C/W | | 300 | 1.5 | 7.50 °C/W | | 500 | 2.5 | 5.60 °C/W | | 700 | 3.5 | 4.70 °C/W | --- ### 4. Typical Applications This specific low-profile (10mm height) heat sink is used in: * **Networking Equipment:** Routers and switches where vertical space is limited. * **Embedded Systems:** Industrial PCs and small form factor boards. * **Power Electronics:** Transistors or voltage regulators requiring localized cooling.