The **ATS-04H-148-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed to provide efficient thermal management for electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.73 °C/W (at 200 LFM) | | **Attachment Method** | Push-pin (Spring Loaded) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm | | **Weight** | 10.42 grams | --- ### 2. Key Components & Design The "Electronic" functionality of this part is passive, meaning it does not use electricity itself but manages the heat generated by active electronic components. * **Fins (Heat Dissipation):** The fins are designed with a specific density to allow airflow (forced or natural convection) to carry heat away from the base. * **Base Plate:** This flat surface makes direct contact with the electronic chip. Thermal Interface Material (TIM) is usually applied here to fill microscopic gaps. * **Push-Pin Attachment:** The "04H" and "R0" designations often refer to the specific spring-loaded push-pins that ensure a consistent "clamping force" on the PCB, preventing the heat sink from shifting and ensuring optimal thermal contact. --- ### 3. Thermal Performance Analysis Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.30 | | 200 (1.0 m/s) | 1.73 | | 400 (2.0 m/s) | 1.35 | | 600 (3.0 m/s) | 1.15 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying the exact variant: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Number of fins or specific series code. * **H:** High-performance profile. * **148:** Specific dimensional footprint/designator. * **C3:** Material/Thermal Interface material package. * **R0:** Packaging or revision code.