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  • ATS-04H-161-C1-R0

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    The **ATS-04H-161-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-04H-161-C1-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Resistance This component is engineered to dissipate heat efficiently. In a typical airflow environment (e.g., 200 LFM), it provides a thermal resistance of approximately **2.21 °C/W**. This determines how many degrees the component temperature will rise per watt of power consumed. #### B. Attachment Mechanism The **Push-Pin** system is critical for electronic PCB assembly: * **Reliability:** Provides consistent pressure on the heat source, ensuring optimal contact with the Thermal Interface Material (TIM). * **Ease of Install:** Allows for quick manual or automated installation without requiring screws or adhesives. #### C. Material Composition * **AL6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just aesthetic; the anodized layer increases surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** For industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs). --- ### 4. Part Number Breakdown (Prefix-Suffix) ```text ATS - 04 H - 161 - C1 - R0 | | | | | | | | | └─ Revision Code | | | └─ Thermal Interface Material (T766) | | └─ Unique Profile Identifier | └─ Fin Height/Design Code └─ Advanced Thermal Solutions (Manufacturer) ```
    ✨ Follow-up Questions
    • ⤷What is the difference between the T766 and T412 thermal interface materials used in these heat sinks?
    • ⤷ How do I calculate the required airflow (LFM) for this specific heat sink model?
    • ⤷ Does this model come in different heights for low-profile server chassis?