ATS-04H-161-C1-R0
AI

The **ATS-04H-161-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or high-power transistors.
---
### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-04H-161-C1-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Plastic) with Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Key Electronic Features
#### A. Thermal Resistance
This component is engineered to dissipate heat efficiently. In a typical airflow environment (e.g., 200 LFM), it provides a thermal resistance of approximately **2.21 °C/W**. This determines how many degrees the component temperature will rise per watt of power consumed.
#### B. Attachment Mechanism
The **Push-Pin** system is critical for electronic PCB assembly:
* **Reliability:** Provides consistent pressure on the heat source, ensuring optimal contact with the Thermal Interface Material (TIM).
* **Ease of Install:** Allows for quick manual or automated installation without requiring screws or adhesives.
#### C. Material Composition
* **AL6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just aesthetic; the anodized layer increases surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion.
---
### 3. Application Use Cases
This specific heat sink is typically used in the following electronic sectors:
1. **Telecommunications:** Cooling network switches and routers.
2. **Embedded Systems:** For industrial PCs where space is limited but heat density is high.
3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs).
---
### 4. Part Number Breakdown (Prefix-Suffix)
```text
ATS - 04 H - 161 - C1 - R0
| | | | |
| | | | └─ Revision Code
| | | └─ Thermal Interface Material (T766)
| | └─ Unique Profile Identifier
| └─ Fin Height/Design Code
└─ Advanced Thermal Solutions (Manufacturer)
```
- ⤷What is the difference between the T766 and T412 thermal interface materials used in these heat sinks?
- ⤷ How do I calculate the required airflow (LFM) for this specific heat sink model?
- ⤷ Does this model come in different heights for low-profile server chassis?