The **ATS-04H-173-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications This part belongs to the **pushPIN™** series and is designed for integrated circuits (ICs) and other heat-generating components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-04H-173-C3-R0 | | **Heat Sink Type** | Push-Pin | | **Fin Type** | Fine-Pitch | | **Fin Pattern** | Straight | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.70°C/W (at 100 LFM) | | **Dimensions** | 30mm x 30mm x 30mm | --- ### 2. Key Design Components #### A. Fin Geometry (The "Top") * **Design:** It utilizes a "Fine-Pitch" vertical fin layout. * **Efficiency:** The high fin density increases the surface area, allowing for better heat dissipation in forced-air (fan-cooled) environments. #### B. Attachment Mechanism (The "Push-Pin") * **Hardware:** It uses a brass push-pin mechanism with a stainless steel spring. * **Function:** This ensures constant pressure against the electronic component (CPU/GPU), which optimizes the thermal interface. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific part usually comes with **T412** thermal tape or grease pre-applied to the base. * **Role:** It fills microscopic air gaps between the chip and the aluminum base to improve heat transfer. --- ### 3. Application Use Cases This component is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PC boards where space is restricted but vertical height is available. 3. **Power Electronics:** Dissipating heat from MOSFETs or Power Management ICs (PMICs). --- ### 4. Thermal Performance Overview As airflow increases, the thermal resistance (the ability of the part to resist heat flow) decreases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.72 | | 200 | 1.0 | 2.98 | | 400 | 2.0 | 2.11 |