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  • ATS-04H-176-C3-R0

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    The **ATS-04H-176-C3-R0** is a high-performance heat sink component manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components, specifically integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 4.40°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Key Components & Materials * **Heat Sink Body:** Extruded aluminum, which offers a high thermal conductivity-to-weight ratio. * **Interface Material (TIM):** This part usually comes with **T412** thermal interface material (pre-applied phase change material or tape) to fill microscopic air gaps between the chip and the heat sink. * **Push-Pins:** Plastic or brass pins used to secure the sink to the PCB. * **Springs:** Stainless steel springs that provide consistent downward pressure (load) to ensure optimal thermal contact. --- ### 3. Thermal Performance Data Thermal performance is measured by how much the temperature rises per watt of power dissipated ($^\circ C/W$). | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 4.40 | 2.50 | 2.02 | 1.77 | | **Ducted Flow** | 2.47 | 1.86 | 1.60 | 1.44 | --- ### 4. Implementation Details The **C3** in the part number indicates a specific color/finish (typically blue anodized) and specific thermal interface material. * **Mounting:** Requires two holes in the PCB, typically spaced 40mm apart for this specific footprint. * **Airflow Direction:** The straight-fin design is optimized for environments with a defined direction of airflow (horizontal or vertical).
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W processor?
    • ⤷ What is the difference between ducted and unducted airflow in this context?
    • ⤷ Are there alternative mounting options if I cannot drill holes in my PCB?