The **ATS-04H-180-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35mm x 35mm x 35mm | | **Fin Style** | Fine-Pitch (Straight) | | **Thermal Resistance** | 3.32°C/W (at 100 LFM) | --- ## 2. Key Electronic & Mechanical Components ### A. The Heat Sink Body Constructed from **Aluminum 6063**, this part offers a balance between weight, thermal conductivity, and cost. The vertical fins increase the surface area, allowing air moving through the system to carry heat away from the electronic package efficiently. ### B. pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system: * **Plastic Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These provide consistent downward pressure, ensuring the heat sink maintains firm contact with the electronic component. ### C. Thermal Interface Material (TIM) The "R0" designation typically implies the part comes with **pre-applied Thermal Interface Material** (usually a phase-change material or high-performance grease). This fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ## 3. Thermal Performance Profile Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 3.32 | | **300 LFM (1.5 m/s)** | 1.80 | | **500 LFM (2.5 m/s)** | 1.44 | --- ## 4. Common Applications * **Telecommunications:** Cooling signal processors in network switches. * **Power Supplies:** Managing heat for MOSFETs and voltage regulators. * **Embedded Systems:** Industrial PCs where high-profile cooling (35mm height) is possible.