ATS-04H-187-C2-R0
AI

The **ATS-04H-187-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic component designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 10.70 °C/W (at 100 LFM) |
| **Flow Orientation** | XC (Cross-cut) / Omnidirectional |
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### 2. Key Component Features
* **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a brass pin and a stainless steel spring. This ensures high pressure and a secure fit to the PCB, improving thermal contact.
* **XC (Cross-Cut) Fin Design:** The fins are cut in a cross-pattern. This design is highly effective for "omnidirectional" airflow, meaning it can dissipate heat efficiently regardless of which direction the air is blowing from.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from environmental corrosion.
* **Low Profile:** With a height of only 10mm, it is designed for space-constrained applications like blade servers or compact networking equipment.
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### 3. Thermal Performance Table
Thermal resistance indicates how many degrees Celsius the component temperature will rise per watt of heat dissipated. Lower numbers at higher airflow (LFM) indicate better cooling.
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 10.70 |
| 300 (1.5 m/s) | 5.56 |
| 500 (2.5 m/s) | 4.35 |
| 700 (3.5 m/s) | 3.73 |
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### 4. Application and Use Cases
* **Processors (BGA/FPGA):** Ideal for mid-sized high-speed chips that generate significant heat.
* **Networking Gear:** Used in routers and switches where airflow might come from various angles.
* **Industrial Controls:** Suitable for power modules in automation hardware.
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How do I calculate the required LFM for my specific chip wattage?
- ⤷ What is the difference between pushPIN and adhesive thermal tape attachments?
- ⤷ Can this heat sink be used with a custom fan shroud?