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  • ATS-04H-187-C2-R0

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    The **ATS-04H-187-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic component designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.70 °C/W (at 100 LFM) | | **Flow Orientation** | XC (Cross-cut) / Omnidirectional | --- ### 2. Key Component Features * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a brass pin and a stainless steel spring. This ensures high pressure and a secure fit to the PCB, improving thermal contact. * **XC (Cross-Cut) Fin Design:** The fins are cut in a cross-pattern. This design is highly effective for "omnidirectional" airflow, meaning it can dissipate heat efficiently regardless of which direction the air is blowing from. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from environmental corrosion. * **Low Profile:** With a height of only 10mm, it is designed for space-constrained applications like blade servers or compact networking equipment. --- ### 3. Thermal Performance Table Thermal resistance indicates how many degrees Celsius the component temperature will rise per watt of heat dissipated. Lower numbers at higher airflow (LFM) indicate better cooling. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.70 | | 300 (1.5 m/s) | 5.56 | | 500 (2.5 m/s) | 4.35 | | 700 (3.5 m/s) | 3.73 | --- ### 4. Application and Use Cases * **Processors (BGA/FPGA):** Ideal for mid-sized high-speed chips that generate significant heat. * **Networking Gear:** Used in routers and switches where airflow might come from various angles. * **Industrial Controls:** Suitable for power modules in automation hardware.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required LFM for my specific chip wattage?
    • ⤷ What is the difference between pushPIN and adhesive thermal tape attachments?
    • ⤷ Can this heat sink be used with a custom fan shroud?