The **ATS-04H-188-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | XCUT (Straight Fin with Cross-Cut) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | ATS-PPS-04 | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features #### A. XCUT Fin Geometry The "XCUT" design features straight fins that have been cross-cut. This creates a matrix of pins that allows for **multi-directional airflow**. Unlike standard straight fins that require air to move in one specific direction, XCUT heat sinks can capture airflow from various angles, making them ideal for crowded PCB environments. #### B. Push-Pin Attachment Mechanism This part uses a mechanical fastening system rather than adhesive tape: * **Reliability:** Provides consistent pressure on the component, improving thermal contact. * **Ease of Assembly:** The brass push-pins snap into pre-drilled holes (3.0mm) on the PCB. * **Spring-Loaded:** The compression springs ensure that the heat sink remains seated even during mechanical shock or vibration. #### C. Thermal Performance (Estimated) * **Thermal Resistance (Customary):** Generally ranges between **6.67°C/W (Unducted)** to **1.33°C/W (at high-velocity ducted flow)** depending on the Air Velocity (LFM). * **Thermal Interface Material:** It comes with **T766**, a high-performance phase-change material or grease that fills microscopic air gaps between the component and the heat sink base. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards. * **Power Supplies:** Cooling voltage regulators or MOSFET arrays. ---