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  • ATS-04H-190-C2-R0

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    The **ATS-04H-190-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules. ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 3.62°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Flow Direction** | Vertical (Cross-cut for omnidirectional airflow) | --- ### 2. Functional Components #### A. The Heat Sink Body (Heatsink) * **Aluminum Construction:** Chosen for its excellent thermal conductivity and lightweight properties. * **Fin Design:** It features a "Cross-Cut" or "Straight Fin" design. Cross-cutting increases the surface area and allows for airflow from multiple directions, making it ideal for enclosures with irregular air currents. * **Blue Anodized Coating:** The blue coating is not just aesthetic; it protects the aluminum from corrosion and slightly improves heat radiation. #### B. The Attachment Mechanism (Push-Pins) * **Plastic Push-Pins:** These provide a secure mechanical connection to the PCB. They are designed for 3.0mm holes. * **Compression Springs:** The stainless steel springs exert a constant, specific downward pressure. This ensures the heat sink remains in tight contact with the electronic chip, which is critical for heat transfer. #### C. Thermal Interface Material (TIM) * **Pre-Applied Phase Change Material:** This model typically comes with a high-performance thermal pad or phase change material (T766) pre-applied to the base. This eliminates the need for manual thermal paste application. --- ### 3. Application Use Cases This part is commonly found in industrial and consumer electronics where mid-to-high heat dissipation is required: * **BGA (Ball Grid Array) Cooling:** Used for FPGAs and ASICs. * **Power Supplies:** Cooling voltage regulators. * **Networking Gear:** Cooling switches and routers. ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the thermal resistance rating (3.62°C/W)?
    • ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
    • ⤷ What are the advantages of push-pin mounting over adhesive tape?