ATS-04H-190-C2-R0
AI

The **ATS-04H-190-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules.
### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 3.62°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Flow Direction** | Vertical (Cross-cut for omnidirectional airflow) |
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### 2. Functional Components
#### A. The Heat Sink Body (Heatsink)
* **Aluminum Construction:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Fin Design:** It features a "Cross-Cut" or "Straight Fin" design. Cross-cutting increases the surface area and allows for airflow from multiple directions, making it ideal for enclosures with irregular air currents.
* **Blue Anodized Coating:** The blue coating is not just aesthetic; it protects the aluminum from corrosion and slightly improves heat radiation.
#### B. The Attachment Mechanism (Push-Pins)
* **Plastic Push-Pins:** These provide a secure mechanical connection to the PCB. They are designed for 3.0mm holes.
* **Compression Springs:** The stainless steel springs exert a constant, specific downward pressure. This ensures the heat sink remains in tight contact with the electronic chip, which is critical for heat transfer.
#### C. Thermal Interface Material (TIM)
* **Pre-Applied Phase Change Material:** This model typically comes with a high-performance thermal pad or phase change material (T766) pre-applied to the base. This eliminates the need for manual thermal paste application.
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### 3. Application Use Cases
This part is commonly found in industrial and consumer electronics where mid-to-high heat dissipation is required:
* **BGA (Ball Grid Array) Cooling:** Used for FPGAs and ASICs.
* **Power Supplies:** Cooling voltage regulators.
* **Networking Gear:** Cooling switches and routers.
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- ⤷
What is the significance of the thermal resistance rating (3.62°C/W)?
- ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
- ⤷ What are the advantages of push-pin mounting over adhesive tape?