The **ATS-04H-200-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself encodes specific characteristics about its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (with springs) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.90°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Physical Dimensions This heat sink follows a square footprint with a low-profile height, making it suitable for compact electronic assemblies. * **Length:** 50.00 mm * **Width:** 50.00 mm * **Height:** 10.00 mm * **Pitch (Fins):** Fine pitch for high-density surface area. --- ### 3. Electronic Application Details #### Thermal Efficiency The device is optimized for **forced air convection**. In electronic systems, as air velocity (LFM - Linear Feet per Minute) increases, the thermal resistance drops significantly. This allows the heat sink to handle higher wattage components in server racks or industrial enclosures. #### Mounting System: pushPIN™ Unlike adhesive-based heat sinks, the "C3" designation refers to a specific mounting hardware configuration: 1. **Mechanical Reliability:** Uses a brass or plastic push-pin with a stainless steel spring. 2. **Constant Pressure:** Ensures the heat sink is pressed firmly against the electronic chip, maximizing heat transfer through the Thermal Interface Material (TIM). 3. **Vibration Resistance:** Ideal for electronics in automotive or industrial environments where mechanical shocks are common. #### Pre-Applied TIM (T412) The unit comes with **T412** thermal material pre-applied to the base. This simplifies the assembly process on a production line and ensures there are no air gaps between the heat sink and the component surface. --- ### 4. Typical Use Cases * **Field Programmable Gate Arrays (FPGAs):** High-heat density logic chips. * **Power Supplies:** Regulating heat in voltage converters. * **Networking Equipment:** Routers and switches with high-speed processing units.