The **ATS-04H-201-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | superGRIP (Clip and Frame) | | **Dimensions** | 50mm x 50mm x 12mm | | **Thermal Resistance** | 8.17°C/W @ 200 LFM | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The "electronic" functionality of this part is purely passive, serving as a thermal management solution. Its design features are optimized for electronic integration: * **superGRIP™ Attachment:** This is a two-component system consisting of a plastic frame clip and a stainless steel spring clip. It allows for high-tension attachment without requiring holes in the Printed Circuit Board (PCB). * **Fin Geometry:** The straight-fin design is optimized for high-performance air cooling. The low profile (12mm height) makes it ideal for dense electronic enclosures where vertical space is limited. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, which is a phase-change material that ensures minimal thermal resistance between the electronic chip (heat source) and the aluminum heat sink. --- ### 3. Application Use Cases This specific model is typically used in the following electronic sectors: 1. **Telecommunications:** For cooling high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where vibration resistance is necessary (the superGRIP ensures the sink doesn't shift). 3. **Power Electronics:** Cooling voltage regulators or power modules that generate localized heat. ---