The **ATS-04H-210-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure stability and longevity. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 70mm x 70mm x 12mm | | **Fin Type** | Straight Fin (Push-Pin) | | **Thermal Resistance** | 5.24°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | --- ### 2. Physical Design and Anatomy The device uses a low-profile design optimized for space-constrained environments. * **Base Plate:** A flat aluminum surface that makes direct contact with the electronic component (usually via a Thermal Interface Material). * **Fin Array:** Uses straight vertical fins to maximize surface area for convective cooling. * **Push-Pin Attachment:** Features a built-in spring-loaded push-pin mechanism. This provides high mounting pressure, which minimizes the air gap between the heat sink and the chip. --- ### 3. Material Properties The **C3** designation in the part number indicates the specific type of Thermal Interface Material (TIM) and finish: * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance. * **Pre-Applied TIM:** This model usually comes with **T766** phase-change material or a similar thermal pad pre-applied to the base, ensuring optimal heat transfer without needing external thermal paste. --- ### 4. Thermal Performance Data Thermal resistance measures how effectively the part moves heat. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.24 | | 400 (2.0 m/s) | 2.85 | | 600 (3.0 m/s) | 2.11 | --- ### 5. Application Use Cases This specific heat sink is typically used for: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processors. 2. **Industrial PCs:** Cooling embedded CPU modules. 3. **Power Electronics:** Managing heat for large MOSFET arrays or IGBTs.