The **ATS-04H-30-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the core technical parameters: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 5.35°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ## 2. Key Components and Design Features ### A. Material and Thermal Interface * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides corrosion resistance but also improves emissivity for radiative cooling. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412 chomerics** thermal tape or high-performance grease to ensure minimal air gaps between the component and the sink. ### B. Mechanical Attachment (Push-Pin) Unlike adhesive-based heat sinks, the **Push-Pin** system provides: 1. **Consistent Pressure:** The springs ensure a uniform downward force, optimizing heat transfer. 2. **Reliability:** It is more secure than thermal tape in high-vibration environments. 3. **Hole Pattern:** Requires pre-drilled holes in the PCB (Printed Circuit Board). ### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling**. In a system with fans, the air flows through the channels between the fins to carry heat away from the base. --- ## 3. Thermal Performance Metrics The effectiveness of the ATS-04H-30-C3-R0 depends on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.38 | | 200 (1.0 m/s) | 5.35 | | 300 (1.5 m/s) | 3.59 | | 400 (2.0 m/s) | 2.77 | --- ## 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where mechanical stability is required via the push-pin mount.