Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-04H-38-C1-R0

  • AI
    The **ATS-04H-38-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the **pushPIN™** series, designed to cool integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded plastic pins) | | **Dimension (Length/Width)** | 36.83 mm x 36.83 mm | | **Height** | 22.86 mm | | **Pitch** | Fine Pitch | | **Pattern** | XC (Cross-Cut) | --- ### 2. Electronic Application & Function In an electronic circuit, the ATS-04H-38-C1-R0 serves the following roles: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET), allowing the heat to transfer into the ambient air more efficiently. * **Thermal Resistance:** It is designed to minimize the temperature rise per watt of power generated. * *Uninterrupted Airflow:* ~6.4°C/W at 100 LFM. * *High Velocity Airflow:* ~1.1°C/W at 700 LFM. * **Protection:** By maintaining a lower operating temperature, it prevents "thermal throttling" and extends the lifespan of the semiconductor device. --- ### 3. Mounting Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: 1. **Spring-Loaded Pins:** Provides consistent pressure across the interface to maximize thermal contact. 2. **Compression Springs:** Ensures the heat sink stays secure even during vibration or mechanical shock. 3. **TIM (Thermal Interface Material):** Usually comes with **T412** or similar pre-applied phase-change material to fill microscopic air gaps between the chip and the aluminum. --- ### 4. Comparison of Airflow Performance ```python # Approximate Thermal Resistance (Celsius per Watt) vs Airflow (LFM) performance_data = { "100_LFM": 6.42, "200_LFM": 2.13, "300_LFM": 1.46, "400_LFM": 1.24, "500_LFM": 1.11 } ```
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting the pushPIN system?
    • ⤷ How does 'Fine Pitch' compare to 'Coarse Pitch' in heat sink design?
    • ⤷ Can this heat sink be used with custom Thermal Interface Materials (TIM)?