AI

The **ATS-04H-38-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the **pushPIN™** series, designed to cool integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The following table highlights the critical mechanical and thermal properties of this part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded plastic pins) |
| **Dimension (Length/Width)** | 36.83 mm x 36.83 mm |
| **Height** | 22.86 mm |
| **Pitch** | Fine Pitch |
| **Pattern** | XC (Cross-Cut) |
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### 2. Electronic Application & Function
In an electronic circuit, the ATS-04H-38-C1-R0 serves the following roles:
* **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET), allowing the heat to transfer into the ambient air more efficiently.
* **Thermal Resistance:** It is designed to minimize the temperature rise per watt of power generated.
* *Uninterrupted Airflow:* ~6.4°C/W at 100 LFM.
* *High Velocity Airflow:* ~1.1°C/W at 700 LFM.
* **Protection:** By maintaining a lower operating temperature, it prevents "thermal throttling" and extends the lifespan of the semiconductor device.
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### 3. Mounting Mechanism: pushPIN™
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system:
1. **Spring-Loaded Pins:** Provides consistent pressure across the interface to maximize thermal contact.
2. **Compression Springs:** Ensures the heat sink stays secure even during vibration or mechanical shock.
3. **TIM (Thermal Interface Material):** Usually comes with **T412** or similar pre-applied phase-change material to fill microscopic air gaps between the chip and the aluminum.
---
### 4. Comparison of Airflow Performance
```python
# Approximate Thermal Resistance (Celsius per Watt) vs Airflow (LFM)
performance_data = {
"100_LFM": 6.42,
"200_LFM": 2.13,
"300_LFM": 1.46,
"400_LFM": 1.24,
"500_LFM": 1.11
}
```
- ⤷
What are the PCB hole requirements for mounting the pushPIN system?
- ⤷ How does 'Fine Pitch' compare to 'Coarse Pitch' in heat sink design?
- ⤷ Can this heat sink be used with custom Thermal Interface Materials (TIM)?