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  • ATS-04H-38-C3-R0

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    The **ATS-04H-38-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the *push-pin* attachment family designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 36.83 x 36.83 x 31.75 mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T412 (Phase-change material) | --- ### 2. Key Electronic Features #### A. Thermal Resistance The primary function of this part is to lower the thermal resistance between the semiconductor junction and the ambient air. * **Performance:** In airflow conditions (approx. 200 LFM), it can achieve a thermal resistance of roughly **1.3°C/W to 2.2°C/W**, depending on the specific application environment. #### B. Attachment & Mechanical Stress Unlike adhesive tapes, the **Push-Pin** system provides: * **Constant Pressure:** The compression springs ensure a consistent 360-degree downward force on the chip, optimizing the performance of the Thermal Interface Material (TIM). * **Reliability:** It is more resistant to shock and vibration compared to "peel-and-stick" heatsinks, making it suitable for industrial electronics. #### C. Airflow Optimization The "Straight Fin" design is optimized for **forced convection** (using a fan). Because the fins are vertical and continuous, air can travel through the channels with lower pressure drops than cross-cut designs, assuming the airflow is directional. --- ### 3. Application Use-Case This part is typically used in the following electronic sectors: * **Networking:** Routers, switches, and base stations. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Embedded Systems:** High-performance ARM or RISC-V processors on custom PCBs. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting the ATS-04H-38-C3-R0?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heatsink be used in passive (fanless) cooling environments?