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The **ATS-04H-38-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the *push-pin* attachment family designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 36.83 x 36.83 x 31.75 mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T412 (Phase-change material) |
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### 2. Key Electronic Features
#### A. Thermal Resistance
The primary function of this part is to lower the thermal resistance between the semiconductor junction and the ambient air.
* **Performance:** In airflow conditions (approx. 200 LFM), it can achieve a thermal resistance of roughly **1.3°C/W to 2.2°C/W**, depending on the specific application environment.
#### B. Attachment & Mechanical Stress
Unlike adhesive tapes, the **Push-Pin** system provides:
* **Constant Pressure:** The compression springs ensure a consistent 360-degree downward force on the chip, optimizing the performance of the Thermal Interface Material (TIM).
* **Reliability:** It is more resistant to shock and vibration compared to "peel-and-stick" heatsinks, making it suitable for industrial electronics.
#### C. Airflow Optimization
The "Straight Fin" design is optimized for **forced convection** (using a fan). Because the fins are vertical and continuous, air can travel through the channels with lower pressure drops than cross-cut designs, assuming the airflow is directional.
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### 3. Application Use-Case
This part is typically used in the following electronic sectors:
* **Networking:** Routers, switches, and base stations.
* **Power Supplies:** Cooling MOSFETs or power ICs.
* **Embedded Systems:** High-performance ARM or RISC-V processors on custom PCBs.
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- ⤷
What are the PCB hole requirements for mounting the ATS-04H-38-C3-R0?
- ⤷ How does the T412 thermal interface material compare to standard thermal grease?
- ⤷ Can this heatsink be used in passive (fanless) cooling environments?