ATS-04H-40-C1-R0
AI

The **ATS-04H-40-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | Straight / Square Pin Fin |
| **Thermal Resistance** | 14.55°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 15.24mm |
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## 2. Key Electronic Functions
While the heat sink itself does not consume electricity, it is critical for the **reliability** and **safety** of electronic circuits:
### Heat Dissipation
It increases the surface area of a heat-generating component. This allows the heat to transfer more efficiently into the surrounding air via convection.
### Thermal Protection
By maintaining the junction temperature ($T_j$) of a semiconductor below its maximum rating, it prevents:
* **Thermal Throttling:** Performance drops in processors.
* **Thermal Runaway:** Catastrophic failure in power transistors.
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## 3. Design Components
* **Push-Pin Mounting:** This model uses a plastic or brass push-pin mechanism. This provides a consistent "Pre-load" force, ensuring the heat sink is pressed firmly against the electronic chip for optimal thermal contact.
* **Thermal Interface Material (TIM):** Usually, these parts come with pre-applied phase-change material or require thermal paste to fill microscopic air gaps between the chip and the aluminum base.
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## 4. Performance vs. Airflow
The efficiency of the **ATS-04H-40-C1-R0** depends heavily on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural) | 14.55 |
| 300 (Forced) | 5.20 |
| 500 (High Flow) | 3.50 |
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- ⤷
What are the advantages of push-pin mounting over adhesive tape for this heat sink?
- ⤷ How do I calculate if this heat sink is sufficient for a 20W power component?
- ⤷ What is the significance of the 'Blue Anodized' finish in electronics?