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  • ATS-04H-40-C1-R0

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    The **ATS-04H-40-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight / Square Pin Fin | | **Thermal Resistance** | 14.55°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 15.24mm | --- ## 2. Key Electronic Functions While the heat sink itself does not consume electricity, it is critical for the **reliability** and **safety** of electronic circuits: ### Heat Dissipation It increases the surface area of a heat-generating component. This allows the heat to transfer more efficiently into the surrounding air via convection. ### Thermal Protection By maintaining the junction temperature ($T_j$) of a semiconductor below its maximum rating, it prevents: * **Thermal Throttling:** Performance drops in processors. * **Thermal Runaway:** Catastrophic failure in power transistors. --- ## 3. Design Components * **Push-Pin Mounting:** This model uses a plastic or brass push-pin mechanism. This provides a consistent "Pre-load" force, ensuring the heat sink is pressed firmly against the electronic chip for optimal thermal contact. * **Thermal Interface Material (TIM):** Usually, these parts come with pre-applied phase-change material or require thermal paste to fill microscopic air gaps between the chip and the aluminum base. --- ## 4. Performance vs. Airflow The efficiency of the **ATS-04H-40-C1-R0** depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 14.55 | | 300 (Forced) | 5.20 | | 500 (High Flow) | 3.50 | ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting over adhesive tape for this heat sink?
    • ⤷ How do I calculate if this heat sink is sufficient for a 20W power component?
    • ⤷ What is the significance of the 'Blue Anodized' finish in electronics?