The **ATS-04H-41-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (with brass springs) | | **Thermal Resistance** | ~10.02 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin (Extruded) | --- ### 2. Physical Design & Construction * **Material:** It is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. * **Fins:** The straight-fin design allows for efficient airflow across the surface area, making it ideal for systems with forced convection (fans). * **Coating:** The "Blue Anodized" finish is not just for aesthetics; it provides corrosion resistance and slightly improves surface emissivity for better radiation heat transfer. --- ### 3. Attachment Mechanism (The Push-Pin) The "C1" and "R0" designations in the part number often refer to the specific attachment kit and thermal interface material (TIM). * **Push-Pins:** These are plastic or brass pins that lock into pre-drilled holes on a Printed Circuit Board (PCB). * **Compression Springs:** These provide the necessary downward force to ensure the heat sink makes firm contact with the electronic chip. * **TIM (Thermal Interface Material):** Usually, these parts come with a pre-applied **Thermal Tape** or grease to fill microscopic air gaps between the component and the heat sink. --- ### 4. Typical Applications This specific size (40x40mm) is commonly found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators. 4. **Legacy Hardware:** Replacement cooling for older Northbridge/Southbridge chipsets. ---