The **ATS-04H-42-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height** | 22.86mm | | **Fin Style** | Straight (optimized for airflow) | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design Features #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is the industry standard for thermal conductivity in heat sinks. The **blue anodized finish** is not just for aesthetics; it provides surface protection and slightly increases emissivity, aiding in heat radiation. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the ATS-04H-42-C2-R0 uses a **Push-Pin and Spring** attachment system. - **Reliability:** Provides consistent downward pressure (load) to ensure the heat sink remains in contact with the electronic chip. - **Safety:** Prevents the heat sink from shifting or falling off during high-vibration environments (e.g., in industrial machinery or servers). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. In electronics, the TIM is critical because it fills the microscopic air gaps between the component (heat source) and the heat sink, drastically reducing thermal resistance. --- ### 3. Thermal Performance (Airflow Data) Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower number indicates better cooling efficiency. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 7.31 | | 400 (2.0 m/s) | 3.85 | | 600 (3.0 m/s) | 2.53 | --- ### 4. Typical Applications This specific heat sink is used in PCB designs where a 45mm square footprint is available, typically for: 1. **Network Switches and Routers:** Cooling the internal processors. 2. **Embedded Systems:** For industrial computers that run 24/7. 3. **Power Electronics:** Cooling MOSFETs or power regulators. ---