The **ATS-04H-45-C1-R0** is a high-performance electronic thermal management component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push-pin" attachment series. --- ### 1. Technical Specifications This component is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or high-power transistors. | Parameter | Specification | | :--- | :--- | | **Product Category** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W)** | 25mm x 25mm | | **Height (Fin Depth)** | 20mm | | **Thermal Resistance** | 14.97°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Straight) | --- ### 2. Key Features * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-CPX-650**, a high-performance phase-change material that improves thermal conduction between the chip and the aluminum base. * **Push-Pin Mounting:** It uses a spring-loaded push-pin mechanism. This provides the necessary pressure for optimal heat transfer and ensures the heat sink remains secure during vibration or shipping. * **Fin Design:** The "Straight Fin" geometry is optimized for forced air cooling (fan-driven airflow). * **Material Efficiency:** The use of 6063 aluminum provides a lightweight solution with high thermal conductivity. --- ### 3. Dimensional Overview The physical footprint is compact, making it suitable for high-density PCB layouts. * **Width/Length:** 25.00 mm * **Height:** 20.00 mm * **Pin Pitch:** Approximately 30mm (between mounting holes) --- ### 4. Application Use Cases This part is commonly found in: 1. **Telecommunications:** Cooling small processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs.