The **ATS-04H-46-C1-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 15mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 11.50°C/W (Unducted Flow @ 100 LFM) | | **Pressure Drop** | 0.10 inH2O (@ 100 LFM) | | **Pitch** | Fine Pitch (High-density fins) | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design This model utilizes a **cross-cut fin pattern**, which allows for multidirectional airflow. In electronic systems where space is tight, this design ensures that air coming from different angles (not just a single linear fan path) can still effectively cool the component. #### 2. The pushPIN™ Attachment System One of the most critical "electronic parts" of this assembly is the attachment mechanism. * **Precision Springs:** Provides a consistent "Force-on-Chip" to ensure the thermal interface material (TIM) is compressed correctly. * **Plastic/Brass Push Pins:** Designed for quick installation on a PCB without the need for complex mounting brackets. #### 3. Thermal Interface Material (TIM) The "R0" suffix often indicates the factory-applied thermal material. For this specific part, it typically comes with **ATS-91** pre-applied, which is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic chip. --- ### Common Applications In the electronics industry, this specific size and thermal rating are commonly used for: * **Voltage Regulator Modules (VRMs)** * **Network Switches and Routers** * **Embedded Systems (Industrial PCs)** * **Memory Modules** ---