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  • ATS-04H-48-C1-R0

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    The **ATS-04H-48-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 25mm | | **Fin Style** | Push-Pin (Straight Fins) | | **Thermal Resistance** | 7.50 °C/W (at 200 LFM) | | **Attachment Method** | Push-Pin with Compression Spring | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Design Features The "push-pin" design of the ATS-04H-48-C1-R0 provides several advantages for PCB assembly: * **Mechanical Reliability:** The push-pin and spring mechanism ensure a consistent pressure between the heat sink and the component, optimizing the thermal interface. * **Ease of Installation:** It uses pre-drilled holes in the PCB, allowing for quick assembly without the need for messy adhesives. * **Straight Fin Geometry:** This design is optimized for **forced-air cooling** (airflow from a fan), allowing air to pass through the fins efficiently. --- ### 3. Part Number Breakdown Understanding the ATS nomenclature helps identify the component variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04H** | Series Type / Height Profile | | **48** | Specific physical dimensions/footprint | | **C1** | Thermal Interface Material (TIM) code | | **R0** | RoHS Compliance status | --- ### 4. Application Use-Cases This heat sink is typically found in: * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs or controllers where space is limited but heat generation is high. * **Power Supplies:** Heat dissipation for voltage regulators and MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the thermal resistance change if the airflow is increased beyond 200 LFM?
    • ⤷ Can the T766 thermal interface material be replaced with high-performance thermal paste?