ATS-04H-48-C1-R0
AI

The **ATS-04H-48-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 30mm x 30mm x 25mm |
| **Fin Style** | Push-Pin (Straight Fins) |
| **Thermal Resistance** | 7.50 °C/W (at 200 LFM) |
| **Attachment Method** | Push-Pin with Compression Spring |
| **Interface Material** | T766 (Thermal Tape/Phase Change) |
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### 2. Design Features
The "push-pin" design of the ATS-04H-48-C1-R0 provides several advantages for PCB assembly:
* **Mechanical Reliability:** The push-pin and spring mechanism ensure a consistent pressure between the heat sink and the component, optimizing the thermal interface.
* **Ease of Installation:** It uses pre-drilled holes in the PCB, allowing for quick assembly without the need for messy adhesives.
* **Straight Fin Geometry:** This design is optimized for **forced-air cooling** (airflow from a fan), allowing air to pass through the fins efficiently.
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### 3. Part Number Breakdown
Understanding the ATS nomenclature helps identify the component variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **04H** | Series Type / Height Profile |
| **48** | Specific physical dimensions/footprint |
| **C1** | Thermal Interface Material (TIM) code |
| **R0** | RoHS Compliance status |
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### 4. Application Use-Cases
This heat sink is typically found in:
* **Telecommunications:** Cooling of high-speed networking chips.
* **Embedded Systems:** Industrial PCs or controllers where space is limited but heat generation is high.
* **Power Supplies:** Heat dissipation for voltage regulators and MOSFETs.
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- ⤷What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the thermal resistance change if the airflow is increased beyond 200 LFM?
- ⤷ Can the T766 thermal interface material be replaced with high-performance thermal paste?