Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-04H-49-C3-R0

  • AI
    The **ATS-04H-49-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the part: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 20.00mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.73 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Design Features #### A. Thermal Interface Material (TIM) The "C3" in the part number indicates that this unit comes pre-applied with **T766 Phase Change Material**. - **Function:** This eliminates the need for manual application of thermal paste. - **Benefit:** It ensures optimal heat transfer between the electronic component surface and the aluminum base of the heat sink. #### B. Mounting Mechanism (Push Pins) The attachment system consists of a spring-loaded push pin: - **Stability:** Provides constant pressure (preload) for better thermal contact. - **Ease of Use:** Allows for quick installation onto pre-drilled holes in the PCB. - **Security:** Reduces the risk of the heat sink shifting during vibration or transport. #### C. Airflow Optimization The straight-fin design is engineered for **forced air cooling** (active cooling with fans). The thermal resistance varies significantly based on the Linear Feet per Minute (LFM) of airflow: * **100 LFM:** 5.63 °C/W * **400 LFM:** 1.77 °C/W --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic applications: 1. **Networking Hardware:** Switches and routers where localized cooling is required for ASICs. 2. **Embedded Systems:** Industrial PCs or controllers that generate moderate heat. 3. **Power Supplies:** Cooling voltage regulators or power transistors. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between Blue Anodized and other finishes for heat sinks?
    • ⤷ How do I calculate the required LFM for my specific electronic component?
    • ⤷ What are the PCB hole diameter requirements for the ATS push pin system?