The **ATS-04H-52-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 25mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 10.74°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Cross-Cut) | | **Spring/Hardware** | Brass / Stainless Steel | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **ATS-04H-52-C1-R0** uses a "pushPIN" mechanism. * **Precision:** It ensures a specific, consistent pressure on the electronic chip, which optimizes the thermal interface. * **Security:** It prevents the heat sink from shifting or falling off during vibration or shipping. #### B. Cross-Cut Fin Design The fin structure is designed for high airflow efficiency. * The square-cut fins increase the surface area for heat radiation. * The design allows for airflow from multiple directions, making it versatile for different PCB layouts. #### C. Thermal Performance Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the silicon. * **Low Flow (100 LFM):** 10.74°C/W * **High Flow (500 LFM):** ~2.31°C/W * As airflow increases, the efficiency of this part improves drastically. --- ### 3. Application Use-Case This part is typically found in: 1. **Industrial PCs:** Cooling embedded processors. 2. **Networking Equipment:** Used on ASICs within routers or switches. 3. **Power Supplies:** To cool MOSFETs or voltage regulators. ---