The **ATS-04H-55-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 24.11°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Features * **pushPIN™ Attachment:** Uses a spring-loaded push-pin mechanism. This ensures consistent pressure across the interface, which is critical for efficient heat transfer. * **Cross-Cut Fin Design:** The "straight fin" or cross-cut geometry allows for airflow from multiple directions, making it versatile for different PCB layouts. * **Blue Anodized Coating:** The surface treatment improves surface emissivity (radiation heat transfer) and provides corrosion resistance. * **Pre-applied TIM:** It comes with T412 thermal grease already applied to the base, reducing assembly time and ensuring a reliable thermal bond. --- ### 3. Thermal Performance (Estimated) Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 24.11 | | 300 (1.5 m/s) | 7.15 | | 500 (2.5 m/s) | 4.43 | --- ### 4. Applications This specific heat sink is typically used in space-constrained environments: 1. **Network Switches:** Cooling ASICs or processors. 2. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where vertical clearance is limited (10mm height).