The **ATS-04H-56-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 6.69°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Compliance** | RoHS Compliant | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just for aesthetics; the anodization layer provides: * Increased surface emissivity (better radiation cooling). * Corrosion resistance. * Electrical insulation to prevent short circuits if it accidentally touches a lead. #### B. The Attachment System (Push-Pins) The "04H" in the part number signifies the specific push-pin and spring assembly. * **Mechanism:** Uses a brass push-pin with a pre-assembled compression spring. * **Purpose:** The spring ensures constant, even pressure on the component (TIM), which is critical for maximizing heat transfer efficiency. * **Hole Pattern:** Designed for specific PCB hole spacings (usually 33mm in this series). #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the unit comes with a **pre-applied Phase Change Material (PCM)** or thermal tape. * This eliminates the need for manual application of thermal paste. * It fills microscopic air gaps between the heat sink base and the chip surface. --- ### 3. Performance Data (Airflow vs. Thermal Resistance) Thermal performance is measured in °C/W (degrees Celsius per Watt). A lower number indicates better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.69 | | 400 (2.0 m/s) | 3.25 | | 600 (3.0 m/s) | 2.50 | | 800 (4.0 m/s) | 2.10 | --- ### 4. Application Use-Cases This specific size (40x40mm) is commonly used in: * **Telecommunications:** Network switches and routers. * **Industrial PC:** Embedded controllers and single-board computers. * **Power Supplies:** Cooling MOSFETs or power ICs. ---