The **ATS-04H-57-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.30°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Pitch** | Fine-Pitch | --- ### 2. Design and Engineering Features * **Fin Design:** It utilizes a **Straight Fin** design, which is optimized for airflow directed through the channel. This allows for high efficiency in forced-air environments. * **pushPIN™ Attachment:** This part features a specialized mounting system that consists of a plastic or brass push-pin and a compression spring. This ensures: 1. **Uniform Pressure:** Prevents damage to the silicon die. 2. **Easy Installation:** No specialized tools are required for mounting to the PCB. * **Material Science:** The aluminum construction offers a balance between lightweight properties and high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity. ### 3. Performance Metrics The effectiveness of this heatsink is measured by its thermal resistance ($^\circ C/W$) relative to the airflow velocity measured in Linear Feet per Minute (LFM). | Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 3.77 °C/W | 13.30 °C/W | | 200 | 2.50 °C/W | 4.70 °C/W | | 400 | 1.80 °C/W | 2.50 °C/W | ### 4. Application Usage This part is typically found in: * **Telecommunications:** Cooling of high-speed processors. * **Computing:** Use on Chipsets, VRMs, or GPUs. * **Industrial Power:** Managing heat in power transistors and MOSFETs. ---