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  • ATS-04H-63-C1-R0

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    The **ATS-04H-63-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as processors, chipsets, or power modules. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Type** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 15.83 °C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Square Fin (High Density) | | **Attachment Material** | Brass (Pin) / Steel (Spring) | --- ### 2. Physical Design and Performance The ATS-04H-63-C1-R0 is engineered for versatility in electronic thermal management: * **Thermal Performance:** The square fin pattern is designed to maximize surface area while allowing for multi-directional airflow. This makes it effective in compact enclosures where airflow might not be perfectly linear. * **The "C1" Classification:** The "C1" in the part number typically refers to the **Thermal Interface Material (TIM)** pre-applied to the base. This ensures maximum heat transfer from the electronic component to the aluminum sink right out of the box. * **The PushPIN Mechanism:** This system uses a spring-loaded pin to provide a precise amount of pressure (compression) on the electronic chip, ensuring optimal contact without damaging the PCB. --- ### 3. Application Use Cases This specific heat sink is commonly found in: * **Embedded Systems:** For cooling SoCs (System on Chips) in industrial computers. * **Telecommunications:** Networking switches and routers where vertical space is limited to 20mm. * **Power Supplies:** Cooling MOSFETs or power ICs that generate localized heat. --- ### 4. Thermal Resistance Profile The efficiency of this part varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 15.83 | 5.76 | 3.22 | 2.27 | 1.82 | ---
    ✨ Follow-up Questions
    • ⤷ What are the mechanical dimensions of the mounting holes required for this pushPIN heat sink?
    • ⤷ Can the TIM (Thermal Interface Material) be replaced with a different brand?
    • ⤷ How does the 'Blue Anodized' finish affect the heat dissipation compared to raw aluminum?