ATS-04H-63-C1-R0
AI

The **ATS-04H-63-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as processors, chipsets, or power modules.
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body) / Blue Anodized (Finish) |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Attachment Type** | pushPIN™ (Spring Loaded) |
| **Thermal Resistance** | 15.83 °C/W (Unducted Flow @ 100 LFM) |
| **Fin Type** | Square Fin (High Density) |
| **Attachment Material** | Brass (Pin) / Steel (Spring) |
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### 2. Physical Design and Performance
The ATS-04H-63-C1-R0 is engineered for versatility in electronic thermal management:
* **Thermal Performance:** The square fin pattern is designed to maximize surface area while allowing for multi-directional airflow. This makes it effective in compact enclosures where airflow might not be perfectly linear.
* **The "C1" Classification:** The "C1" in the part number typically refers to the **Thermal Interface Material (TIM)** pre-applied to the base. This ensures maximum heat transfer from the electronic component to the aluminum sink right out of the box.
* **The PushPIN Mechanism:** This system uses a spring-loaded pin to provide a precise amount of pressure (compression) on the electronic chip, ensuring optimal contact without damaging the PCB.
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### 3. Application Use Cases
This specific heat sink is commonly found in:
* **Embedded Systems:** For cooling SoCs (System on Chips) in industrial computers.
* **Telecommunications:** Networking switches and routers where vertical space is limited to 20mm.
* **Power Supplies:** Cooling MOSFETs or power ICs that generate localized heat.
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### 4. Thermal Resistance Profile
The efficiency of this part varies based on the airflow (LFM - Linear Feet per Minute):
| Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Thermal Res (°C/W)** | 15.83 | 5.76 | 3.22 | 2.27 | 1.82 |
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- ⤷
What are the mechanical dimensions of the mounting holes required for this pushPIN heat sink?
- ⤷ Can the TIM (Thermal Interface Material) be replaced with a different brand?
- ⤷ How does the 'Blue Anodized' finish affect the heat dissipation compared to raw aluminum?