The **ATS-04H-64-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, FPGAs, and power modules. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-04H-64-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimension (Length x Width)** | 40mm x 40mm | | **Height (Profile)** | 25mm | | **Fin Type** | Fine-Pitch (Straight) | | **Thermal Resistance** | 9.37°C/W (at 1.0 m/s airflow) | --- ### ## Key Electronic Components & Design Features #### 1. PushPIN™ Attachment System Unlike traditional adhesive-based heat sinks, the "R0" series uses a **pushPIN™** system. * **Spring-loaded mechanism:** Provides consistent pressure (Pre-assembled with a compression spring). * **Attachment:** Uses plastic or brass pins that lock into pre-drilled holes on the PCB. * **Reliability:** Ensures maximum thermal interface material (TIM) contact and prevents the heat sink from shifting during vibration or shipping. #### 2. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization process increases **surface emissivity**, allowing for better heat radiation and providing corrosion resistance. #### 3. Thermal Interface Material (TIM) The "C1" designation typically refers to the pre-applied thermal interface. * **Function:** It fills the microscopic air gaps between the heat-generating component (e.g., a chip) and the flat bottom of the heat sink. * **Efficiency:** This reduces contact resistance, allowing heat to flow more freely into the aluminum fins. --- ### ## Performance Overview The efficiency of this part is highly dependent on **Airflow (LFM - Linear Feet per Minute)**. | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Unducted) | 9.37 | | 2.0 (Unducted) | 3.30 | | 3.0 (Unducted) | 2.42 | *Note: As airflow increases, the thermal resistance drops significantly, making it ideal for forced-convection environments (systems with fans).* ---