The **ATS-04H-67-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The following table details the physical and thermal properties of the unit: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 12.28°C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 10mm | | **Fin Style** | Straight (Cross-Cut) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Key Components & Features #### A. The Heat Sink Body The body is made of **extruded aluminum**. Aluminum is chosen for its excellent balance between thermal conductivity and weight. The "67" series features a low-profile height (10mm), making it ideal for compact electronic enclosures where vertical space is limited. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Brass Push-Pins:** These provide consistent pressure to ensure optimal contact between the heat sink and the component. * **Compression Springs:** These maintain the necessary force to prevent air gaps during thermal expansion and vibration. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a phase-change or high-performance thermal pad that fills microscopic air gaps between the chip and the aluminum base, significantly reducing thermal resistance. --- ### 3. Thermal Performance Comparison The performance of the ATS-04H-67-C1-R0 is highly dependent on airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 12.28 | | 300 | 1.5 | 2.50 | | 500 | 2.5 | 1.60 | --- ### 4. Application Context This part is typically used in the following electronic systems: * **Networking Gear:** Cooling ASICs in switches and routers. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Electronics:** Dissipating heat from high-speed FPGA or memory controllers.