The **ATS-04H-69-C1-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push-pin" series designed for localized cooling of electronic components like CPUs, GPUs, and FPGAs. --- ## Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Resistance** | 11.46°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied thermal pad) | | **Airflow Path** | Horizontal | --- ## Key Features ### 1. Attachment Mechanism The "R0" designation refers to the attachment style. This model uses **plastic push-pins** and **brass springs**. * **Precision:** The springs apply a specific amount of pressure (force) to ensure the heat sink remains in optimal contact with the semiconductor. * **Stability:** It requires two pre-drilled holes on the PCB (Printed Circuit Board). ### 2. Thermal Interface Material (TIM) The device comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink, significantly improving heat transfer efficiency. ### 3. Material and Coating * **Aluminum:** Chosen for its lightweight properties and high thermal conductivity. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases the surface emissivity, which helps slightly with radiation cooling and provides corrosion resistance. --- ## Usage Considerations ### Application Suitability This heat sink is ideal for "Cross-Cut" or "Straight Fin" cooling environments where there is a consistent directional airflow. Because it is 20mm tall, it is suitable for 1U or 2U server chassis and mid-profile telecommunications equipment. ### Design Compatibility When integrating the ATS-04H-69-C1-R0, engineers must ensure: 1. **PCB Hole Pattern:** The holes must match the specific pitch of the ATS push-pins. 2. **Clearance:** The 45x45mm footprint must not interfere with surrounding surface-mount components (capacitors, resistors). 3. **Airflow Direction:** Straight fins are highly directional; they must be aligned parallel to the system fans for maximum efficiency. ---