ATS-04H-74-C3-R0
AI

The **ATS-04H-74-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the *maxiFLOW™* series, designed for cooling high-power electronic components like CPUs, GPUs, and FPGAs.
---
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | pushPIN™ (Brass Pins / Steel Springs) |
| **Dimensions** | 25.0mm x 25.0mm x 25.0mm |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
| **Thermal Resistance** | 8.00°C/W @ 100 LFM (linear feet per minute) |
| **Thermal Interface Material** | T412 (Phase Change Material) |
---
### 2. Key Electronic Features
#### A. Thermal Performance
This part is designed to dissipate heat from surface-mount devices (SMD). Its **maxiFLOW™** geometry features a tapered fin design that maximizes surface area and increases air turbulence, significantly reducing thermal resistance compared to standard straight-fin heat sinks.
#### B. Attachment Mechanism (pushPIN™)
The "R0" designation refers to the mounting hardware. It utilizes a **pushPIN™** system which provides:
* **Precision Pressure:** Ensures the correct amount of force is applied to the chip for optimal thermal transfer.
* **Secure Fit:** Prevents the heat sink from shifting during vibration or shock.
* **Pre-drilled Holes:** Designed for PCBs with 20.0mm x 20.0mm hole patterns.
#### C. Thermal Interface Material (TIM)
The base comes pre-applied with **T412**, a high-performance thermal pad. This material fills microscopic air gaps between the component and the heat sink, ensuring efficient heat conduction without the mess of manual thermal paste application.
---
### 3. Application Use Cases
This specific model is frequently found in high-density electronic assemblies such as:
1. **Telecommunications:** Network switches and routers.
2. **Embedded Computing:** Industrial PC modules.
3. **Power Electronics:** Voltage regulators and high-speed motor controllers.
- ⤷
How does the maxiFLOW fin design compare to standard straight fins?
- ⤷ What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ Can the T412 thermal interface be replaced with traditional thermal paste?