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  • ATS-04H-74-C3-R0

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    The **ATS-04H-74-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the *maxiFLOW™* series, designed for cooling high-power electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins / Steel Springs) | | **Dimensions** | 25.0mm x 25.0mm x 25.0mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Thermal Resistance** | 8.00°C/W @ 100 LFM (linear feet per minute) | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ### 2. Key Electronic Features #### A. Thermal Performance This part is designed to dissipate heat from surface-mount devices (SMD). Its **maxiFLOW™** geometry features a tapered fin design that maximizes surface area and increases air turbulence, significantly reducing thermal resistance compared to standard straight-fin heat sinks. #### B. Attachment Mechanism (pushPIN™) The "R0" designation refers to the mounting hardware. It utilizes a **pushPIN™** system which provides: * **Precision Pressure:** Ensures the correct amount of force is applied to the chip for optimal thermal transfer. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shock. * **Pre-drilled Holes:** Designed for PCBs with 20.0mm x 20.0mm hole patterns. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T412**, a high-performance thermal pad. This material fills microscopic air gaps between the component and the heat sink, ensuring efficient heat conduction without the mess of manual thermal paste application. --- ### 3. Application Use Cases This specific model is frequently found in high-density electronic assemblies such as: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Computing:** Industrial PC modules. 3. **Power Electronics:** Voltage regulators and high-speed motor controllers.
    ✨ Follow-up Questions
    • ⤷ How does the maxiFLOW fin design compare to standard straight fins?
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?
    • ⤷ Can the T412 thermal interface be replaced with traditional thermal paste?