The **ATS-04H-76-C1-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Fin Style** | Straight Fin (provides high surface area) | | **Material** | Aluminum (AL6063) | | **Attachment Type** | Push-Pin (spring-loaded plastic or metal pins) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | Pre-applied (usually T766) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity and weight efficiency. The "Blue Anodized" coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiation heat transfer. #### B. The Attachment Mechanism (Push-Pin) This model uses the **pushPIN™** system. Instead of using adhesive tape (which can fail over time) or complex screw mounts, it uses: * **Plastic or Brass Pins:** These snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent "Force-on-Die" pressure, ensuring the heat sink stays in contact with the component even under mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the unit comes with a pre-applied layer of thermal grease or a thermal pad. This fills the microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. --- ### 3. Thermal Performance Indicators Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). The lower the number, the better the heat sink performs. * **Unducted Flow:** Higher resistance (requires more airflow to cool). * **Ducted Flow:** Lower resistance (optimized when air is forced through the fins). --- ### 4. Common Applications * **Northbridge/Southbridge chips** on motherboards. * **Power management modules** (VRMs). * **Small Form Factor (SFF) industrial PCs.** * **Network switches and routers.**