The **ATS-04H-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Type** | Straight Fin (High density) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | ~10.97 °C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **TIM (Thermal Interface Material)** | T412 (High performance) | --- ### 2. Key Components & Design The effectiveness of this part relies on several mechanical and material choices: * **Push-Pin Attachment:** Instead of messy adhesives, it uses plastic or brass push-pins and a compression spring. This ensures a precise, consistent pressure against the electronic component for optimal heat transfer. * **High-Density Fin Array:** The "Straight Fin" design is optimized for high-velocity airflow environments (active cooling), maximizing the surface area available to dissipate heat into the air. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing provides increased corrosion resistance and slightly improves the emissivity of the aluminum surface. * **Pre-Applied TIM:** The base comes with **T412** thermal interface material, which fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling line cards and routers. 2. **Industrial PCs:** Cooling embedded processors in high-temperature environments. 3. **Power Supplies:** Managing heat for MOSFETs or high-speed switching transistors. --- ### 4. Comparison: Active vs. Passive Cooling | Feature | ATS-04H-82-C3-R0 Performance | | :--- | :--- | | **Low Airflow (Passive)** | Higher resistance; less effective for high-wattage chips. | | **High Airflow (Active)** | Thermal resistance drops significantly (down to ~2.11 °C/W at 600 LFM). |