The **ATS-04H-83-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic surface-mount devices like BGA, FPGA, or CPU packages. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part number: | Specification | Details | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 20.00 mm | | **Thermal Resistance (Flowing)** | 1.58 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.99 °C/W | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | Straight | --- ### 2. Component Features #### A. Attachment Mechanism: pushPIN™ This part uses a proprietary **pushPIN™** system. Instead of using messy adhesives or thermal tape, it uses plastic pins and stainless steel springs to apply consistent pressure to the processor. This ensures: * Optimal contact with the thermal interface material (TIM). * Quick assembly and disassembly. * Secure mounting during vibration or shipping. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized coating increases surface emissivity and provides corrosion resistance. #### C. Thermal Performance The "Straight Fin" design is optimized for **forced air cooling** (environments with fans). The thermal resistance drops significantly as airflow increases, as shown below: ```text Airflow Velocity | Thermal Resistance -------------------------------------- 100 LFM (0.5 m/s) | 4.99 °C/W 200 LFM (1.0 m/s) | 2.80 °C/W 500 LFM (2.5 m/s) | 1.75 °C/W ``` --- ### 3. Application Use Cases This heat sink is typically found in: * **Networking Hardware:** Routers and switches. * **Industrial Computing:** Embedded PC boards. * **Power Electronics:** Transistor modules and voltage regulators. * **Consumer Electronics:** High-end audio/video processing units.