The **ATS-04H-84-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components such as CPUs, GPUs, FPGAs, and power modules. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimension (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 6.96°C/W @ 100 LFM (Airflow) | | **Attachment Method** | pushPIN™ | | **Fin Type** | Straight Fin | | **Thermal Interface Material (TIM)** | No TIM (Pre-applied optional) | --- ### 2. Design Features * **High Aspect Ratio Fins:** The straight-fin design provides a large surface area for heat dissipation while maintaining a compact footprint, making it suitable for high-density PCB layouts. * **pushPIN™ Attachment:** This model utilizes the ATS pushPIN™ mounting system. It features a flexible, tool-free mechanism with a variety of spring-loaded options to ensure precise pressure and secure attachment to the PCB. * **Airflow Efficiency:** The fin spacing is optimized for forced air convection, allowing for efficient heat transfer even at lower air velocities. ### 3. Thermal Performance (Estimated) The efficiency of the heat sink depends on the airflow speed (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.96 | | 200 (1.0 m/s) | 3.42 | | 300 (1.5 m/s) | 2.62 | | 400 (2.0 m/s) | 2.21 | --- ### 4. Typical Applications * **Computing:** Cooling of secondary processors or high-speed memory controllers. * **Telecommunications:** Network switches and routers where vertical space is available. * **Industrial Electronics:** Embedded systems and motor controllers requiring robust vibration-resistant mounting.