The **ATS-04H-85-C1-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits. --- ### 1. Technical Specifications The table below summarizes the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Fin Type** | Straight Fin (Extrusion) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 23.94°C/W (at 100 LFM) | | **Flow Orientation** | Vertical/Horizontal (Directional) | --- ### 2. Key Components & Design Features #### A. Fin Profile (Straight Fin) The "85" series features a straight-fin design. This is optimized for systems with a clear path for airflow. The low profile (10mm) makes it ideal for 1U servers or space-constrained embedded systems. #### B. Push-Pin Attachment Instead of using adhesive tape or epoxy, this part uses a mechanical **push-pin and brass spring** mechanism. * **Reliability:** Provides consistent pressure (preload) on the component, improving thermal interface material (TIM) performance. * **Ease of Maintenance:** Can be removed and reinstalled without damaging the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied high-performance **T766 phase-change material** or equivalent thermal pad on the base, ensuring immediate heat transfer upon installation. --- ### 3. Thermal Performance Analysis Thermal resistance ($\theta$) indicates how many degrees Celsius the component will rise per Watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 23.94 | | 300 (Medium) | 10.19 | | 500 (High) | 7.70 | --- ### 4. Typical Applications * **Networking:** Switches, routers, and high-speed modems. * **Processing:** Field Programmable Gate Arrays (FPGAs) and DSPs. * **Power Electronics:** Voltage regulators and MOSFET modules that require active or passive cooling.