The **ATS-04H-87-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm | | **Thermal Resistance** | ~13.12 °C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Geometry * **Design:** This part features a **straight-fin** design. * **Purpose:** Straight fins are optimized for high-performance cooling in environments where there is a consistent directional airflow (ducted or unducted). #### B. Attachment System (Push-Pin) * **Mechanism:** It uses a brass or plastic push-pin with a compressed spring. * **Electronic Safety:** The spring-loaded mechanism ensures even pressure across the electronic component, preventing mechanical stress that could crack a silicon die or damage solder balls (BGA). #### C. Thermal Interface Material (TIM) * **Material:** It comes with **T766** pre-applied. * **Function:** This is a phase-change or high-conductivity pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal impedance. --- ### 3. Application Use Cases This heat sink is typically found in the following electronic systems: 1. **Networking Hardware:** Switches, routers, and high-speed gateways. 2. **Industrial PCs:** Small form-factor motherboards requiring passive or semi-passive cooling. 3. **Power Electronics:** Voltage regulators or high-power LED drivers that require stable temperature regulation. --- ### 4. Thermal Performance Comparison Below is an estimate of thermal resistance based on airflow velocity: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 13.12 | | 400 (2.0 m/s) | 6.75 | | 600 (3.0 m/s) | 4.90 |