The **ATS-04H-97-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the *push-pin* attachment series designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-04H-97-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Interface (TIM)** | T766 (Pre-applied Phase Change Material) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 20.24 °C/W (at 100 LFM) | --- ### 2. Breakdown of Components #### A. The Heatsink Body * **Material:** Made of high-grade aluminum for high thermal conductivity and lightweight properties. * **Design:** Features a "Straight Fin" design. This is optimized for systems with **forced air convection** (fans). The fins increase the surface area, allowing heat to transfer from the component to the passing air more efficiently. * **Finish:** The blue anodized coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. #### B. Attachment Mechanism (Push-Pins) * **Hardware:** It utilizes plastic push-pins and springs. * **Function:** The push-pin system ensures a constant, predefined pressure between the heatsink and the electronic chip. This "spring-load" is critical because it maintains a tight bond even as materials expand and contract due to temperature cycles. #### C. Thermal Interface Material (TIM) * **Type:** T766. * **Role:** There are microscopic air gaps between a metal heatsink and a silicon chip. The T766 material fills these gaps. It is a "Phase Change" material, meaning it softens when it reaches operating temperature to create a seamless thermal bridge. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking processors. 2. **Embedded Systems:** For industrial PCs where space is constrained (low 10mm profile). 3. **Power Supplies:** Managing heat in voltage regulators or power transistors.