The **ATS-04H-99-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-power semiconductors. --- ### 1. Technical Specifications The following table summarizes the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 11.49°C/W (Unducted Flow @ 100 LFM) | | **Airflow Pattern** | Vertical (Fine Pitch) | --- ### 2. Key Electronic Components Features #### A. pushPIN™ Attachment System The "R0" designation typically refers to the attachment kit. This heat sink uses a spring-loaded **pushPIN™** mechanism. - **Benefit:** It provides a precise and consistent pressure (Pre-assembled with a compression spring) across the component surface, ensuring optimal thermal interface material (TIM) performance. #### B. Thermal Performance The efficiency of this part is measured by its ability to dissipate heat away from a chip to the ambient air. - **Fin Design:** It features a high-performance "Straight Fin" design that maximizes surface area. - **Velocity Sensitivity:** At high airflows (e.g., 500 LFM), the thermal resistance drops significantly (to approx. 1.70°C/W), making it ideal for forced-convection environments (server racks, high-end PCBs). #### C. Material & Coating - **Aluminum Construction:** Offers a balance between lightweight design and thermal conductivity. - **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Application Use Cases 1. **ASIC/FPGA Cooling:** Ideal for mid-sized programmable logic devices that generate 5W–20W of heat. 2. **Power Supplies:** Cooling MOSFETs or rectifiers in industrial power converters. 3. **Telecommunications:** Used in networking switches where vertical airflow is managed by chassis fans. ---