The **ATS-05A-76-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" heat sink line designed for thermal management of semiconductors. ### 1. Product Overview This part is a high-performance heat sink designed for high-density electronic boards where airflow is available but space is limited. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Mechanical Attachment) | | **Material** | Aluminum (Blue Anodized Finish) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring clearance from neighboring components. * **Size:** 25.0 mm x 25.0 mm * **Height:** 15.0 mm * **Mounting Style:** Push-pins with springs for secure attachment. * **Hole Spacing:** Designed for specific pitch requirements on the PCB to ensure uniform pressure. --- ### 3. Thermal Performance The efficiency of a heat sink is measured by its thermal resistance ($^\circ\text{C/W}$). A lower number indicates better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance ($^\circ\text{C/W}$) | | :--- | :--- | | 200 (1.0 m/s) | 11.50 | | 400 (2.0 m/s) | 7.75 | | 600 (3.0 m/s) | 6.45 | --- ### 4. Key Component Features 1. **Straight Fin Design:** Optimized for "all-around" airflow, though it performs best when aligned with the direction of the system fans. 2. **Pre-applied TIM:** The "T766" thermal interface material ensures a low-resistance thermal path between the chip and the aluminum base without needing manual application of paste. 3. **Mechanical Attachment:** The use of push-pins provides a more reliable and durable connection than adhesive tapes, especially in high-vibration environments or for heavier heat sinks. --- ### 5. Application Use Cases * **BGA Packages:** Commonly used for cooling Ball Grid Array (BGA) chips such as FPGAs, CPUs, and GPUs. * **Networking Gear:** Found in routers, switches, and high-speed communication hardware. * **Embedded Systems:** Industrial PCs where longevity and physical security of the cooling system are required.