The **ATS-05B-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling high-power semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM / 0.5 m/s) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 12.70 mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Configuration** | Fine Pitch (cross-cut for multi-directional airflow) | --- ### 2. Design and Engineering Features ### A. pushPIN™ Attachment System The part utilizes the ATS proprietary **pushPIN™** system. This allows for: * **Uniform Pressure:** A compression spring provides a consistent load on the electronic component, ensuring optimal thermal interface material (TIM) performance. * **Easy Installation:** Features pre-drilled holes for secure mounting to a PCB without the need for messy adhesives. ### B. Thermal Performance The "C3" designation indicates a specific performance tier within the product family. The heat sink is designed for **forced air cooling** environments. As airflow increases, the thermal resistance drops significantly: * **500 LFM (2.5 m/s):** ~3.82 °C/W * **700 LFM (3.5 m/s):** ~2.83 °C/W ### C. Material and Finish The heat sink is made from **Aluminum 6063**, which offers a balance of high thermal conductivity and low weight. The **Blue Anodized** finish provides: * Increased surface emissivity (better radiation cooling). * Corrosion resistance. * Electrical insulation on the surface. --- ### 3. Common Applications This specific heat sink size (45mm x 45mm) is commonly used for cooling: 1. **BGA Packages:** Large Ball Grid Array processors. 2. **FPGAs:** Field Programmable Gate Arrays used in telecommunications. 3. **Power Converters:** High-density DC-DC converters. 4. **Network Switches:** Cooling internal high-speed switching chips.